Electronic panels and semiconductors

1)Basically used for vacuum sealing, the materials are FKM, FKM-GF, FFKM.

2)In the TF, ETCH, and Diff processes of electronic panels made into FPD, the sealing applications of various vacuum pumps, pipeline connection KF/ISO flanges, vacuum valves (pendulum valves, slit valve doors, etc.) meet the requirements of resistance to various corrosive gases and cleanliness.

FPD process categoryProcessTemperatureWorking conditions
TFCVD70~200℃Cl2, O2, SF6, SO2, NF3, BCl3, C2HF5, H2, CHF3, Ar,Cl2, SF6, O2, C2HF, BCl3, CF4
PVDSiH4, NH3, PH3, N2, NF3, Ar, Ph3, H2, N2O
ETCHDry Etching25~150℃TMAH, Photo Resists
Wet EtchingH3PO3, HNO3, CH3COOH, NaOH
Difflon lmplantation25~200℃SC-1, SC-2,, Alkaline, HF,Cl2, SF6, O2, C2HF, BCl3, CF4
DiffusionMonoethanol amine (MEA)

3)In the plasma processes, thermal processes and wet processes of semiconductor wafer manufacturing, various vacuum acquisition equipment, vacuum coating equipment, cleaning equipment, vacuum valves, KF/ISO vacuum flanges, gate valve seals and other applications require resistance to various types of corrosive gases, plasma, high temperature and long service life, and also require sealing rings with high purity, low particle, low outgassing (low weight-loss), low trace metal levels, etc.

Wafer process categoryProcessTemperatureWorking conditions
Plasma ProcessesEtch25~200℃Cl2,BCl3,NF3,CHF3,HBr,C2F6,O2,CCl4,N2H2,SF6,SiCl4,,N2O,NF3
DieletricEtch25~200℃C2F6,H2,O2,NF3,CHF3,CF4,CHF3,SF6
PECVD25~300℃TMS,TEP,DEMS,TEOS,SiH4,NH3,
HDPCVDSiF4,C3H6,O2,NF3
Ashing/Stripping25~250℃O2,CF4,CHF3,NH3
Thermal ProcessesSACVD25~300℃TEP, TEBO, TEOS, NF3, NH3,O3,O2,N2

Metal CVD & ALD

LPCVD

25~300℃Organic precursors, WF6, SiH6, TMA, DMAH,TiCl4,SiH4,HF,Cl2,SiH2Cl3,ClF3,NF3,H2O Vapour,O2,O3
Lamp annealer RTP150~300℃IR radiaion,O2,Steam
Oxidation diffusion150~300℃N2, O2, H2O, HCl, Cl2,B2H6,PH3,BBr3,POCl3
UV cure150~300℃N2, O2,O3,Ar
Thermal-ALD150~300℃TEOS, SiH4, NH3, SiF4, CF4,NF3
Wet ProcessesWafer Prep25~125℃SC1, SC2, SPM, HF, UPDI
CMP25~100℃KOH, NH3, UPDI
Photolithography125~125℃TMAH, NaOH, H2SO4+Oxidant,Organic acids,NMP,Amines
Stripping25~125℃NMP, MEA, HDMS, DMSO
Cleaning/ Etching25~180℃HCl, HNO3, H3PO4, HF, UPDI ,SC1,SC2,O3
Copper Plating25~100℃CuSO4, H2SO4, H2O2

Seals for electronic panels and semiconductor manufacturing

ISO CENTER RING

ISO CENTER RING

KF center ring

Slit valve door seal

Slit-valve door seal

Ultrapure FFKM

Ultrapure FFKM

Ultrapure FFKM

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