Perfluoroether rubber (FFKM)

Perfluoroether rubber (FFKM) has carbon atoms in the main chain or side chain of the molecule combined with fluorine atoms, so perfluoroelastomer has the best temperature resistance and chemical resistance among all elastomer materials. It has excellent tolerance to fuels, various lubricants, solvents, alcohols, and most acids and alkalis.

Bridging cross-linking system

Peroxide system bridging: the most common FFKM bridging method, outstanding chemical resistance formula

Triazine system bridging: good heat resistance, outstanding long-term sealing and durable stress relaxation performance

Hao Seal's FFKM mainly uses SOLVAY Tecnoflon® series compounds

Tecnoflon® PFR 94及 & Tecnoflon®PFR 06HC

     Tecnoflon® PFR94 and Tecnoflon® PFR 06HC are designed for the chemical, oil and gas industries and have the highest chemical resistance of all rubbers; especially when used with polar fluids such as organic and inorganic acids, ketones, aldehydes, esters, ethers, alcohols, fuels, solvents, acid gases, hydrocarbons, steam, hot water, ethylene and propylene oxides and mixed process fluids, they outperform FKM materials. PFR94 and PFR06HC perform similarly in 70C° amines, but when the temperature is above 70°C and in contact with amines, strong oxidizing solvents, PFR06HC performs better than PFR 94. PFR94 is FDA-approved for food use, and PFR06HC is mainly used in industry. Temperature range from -10°C to +230°C

Tecnoflon® PFR 95HT

     Tecnoflon® PFR95HT has excellent heat resistance and can maintain sealing performance at high temperatures, which is better than other high-temperature chemical materials under high-temperature steam conditions. PFR95H can withstand 280C° for a long time and 300C° for a short time. It can provide a wide range of chemical resistance to various media, including acids, ketones, aldehydes, esters, ethers, methanol, solvents, acid gases, hydrocarbons, water vapor, hot water and mixed process fluids as well as excellent heat resistance.

Tecnoflon® PFR5910M & Tecnoflon®PFR5920M

      Tecnoflon® PFR5910M and PFR5920M are specially designed for the semiconductor industry, without the use of mineral fillers to avoid the generation of particles in the chamber under aggressive plasma conditions. Solvay's proprietary co-coagulation technology allows the use of PTFE particles smaller than 40nm, ensuring that these particles are well dispersed, achieving mechanical properties equivalent to mineral-filled perfluoroelastomers and superior to other materials on the market. Both PFR 5910M and PFR 5920M are low molecular weight rubbers, and have higher transparency than several other perfluoroether rubbers. The difference between the two lies mainly in the different PTFE content of the filler.

Tecnoflon® PFR LT 

    Developed to meet the latest and most stringent requirements of the oil and gas industry. Solvay's proprietary MOVE technology gives perfluoroelastomer excellent chemical resistance and unparalleled, higher low-temperature flexibility (TR10 = -30°C). The operating temperature range is -30℃~+230℃.

Tecnoflon®X1055B

    Tecnoflon® PFR X1055B is a new perfluoroelastomer (FFKM) that offers outstanding heat resistance, lower compression set and enhanced seal force retention at extreme temperatures. Tecnoflon® PFR X1055B is suitable for most applications in the temperature range of –10°C to +315°C.

    In addition to its outstanding thermal resistance, it also offers a wide range of chemical resistance in a variety of media including acids, caustics, ketones, aldehydes, esters, ethers, alcohols, solvents, sour gases and hydrocarbons. However, even with such excellent chemical resistance, PFR1055B is not recommended for aqueous media and amine applications. This unique combination of thermal and chemical resistance makes Tecnoflon® PFR X1055B the sealing material of choice for high temperature chemical and hydrocarbon processing industries and aerospace applications.

    At the same time, Tecnoflon® PFR X1055B's extremely high cleanliness (low metal ion content, low extractables) and its excellent thermal stability and plasma resistance make Tecnoflon® PFRX1055B a very suitable sealing material for most dry plasmas (ETCH, PECVD, LPCVD, Metal CVD, PVD, ALD, Plasma) and high temperature thermal processes in the semiconductor manufacturing industry.

Tecnoflon®X1065O & Tecnoflon®X1075O

    Tecnoflon® X1065O & Tecnoflon® X1075O perfluoroelastomers (FFKM) are designed for high purity performance applications requiring thermal stability, primarily for semiconductor manufacturing applications. PFR X1065O and PFR X1075O are thermal upgrades of Tecnoflon® 5910MPFR and 5920M; both are suitable for use in the +300°C temperature range.

    PFR X1065O and PFR X1075O contain very finely divided PTFE as organic filler: it does not use traditional fillers such as carbon black or mineral fillers such as BaSO4, TiO2, SiO2, alumina and aluminum silicate, since particles are generated under Plasma attack , leading to particle contamination of the chamber. On the other hand, PTFE and FFKM have similar etch rates, so the polymer-filled compound can be completely etched to form volatiles, significantly reducing the potential for particle generation.

    The main characteristics of Tecnoflon® PFR X1065O and PFR X1075O are as follows:

        • High purity (low extractables)

        • Very good resistance to oxygen and fluorine plasma

        • Very low particle generation

        • Low outgassing

        • Low friction

        • High wear resistance

        • Low modulus

        • Excellent mechanical properties

    The basic properties of the base polymers are as follows: Good plasma and chemical resistance at extreme cleaning and very high temperatures (300°C) make Tecnoflon® PFR X1065O and PFR X1075O the best sealing materials in their class for most dry etching processes (Plasma Etching, PECVD, LPCVD, Metal CVD, PVD, ALD) and wet semiconductor processes (wafer cleaning, polymer removal, wet etching, polishing).

    The main difference between the two is the different PTFE content.

Tecnoflon®X2160B

    Tecnoflon® PFR2160B is a new perfluoroelastomer (FFKM) that offers excellent heat resistance and lower compression set, providing long-term seal retention in extreme temperatures.

    PFR 2160B is suitable for most applications in the temperature range from -10°C to +315°C (even up to 350°C for short term applications), providing long term temperature sealing at very high temperatures.

    In addition to excellent heat resistance, it also provides a wide range of chemical resistance in a variety of media, including acids, ketones, aldehydes, esters, ethers, alcohols, solvents, acid gases and hydrocarbons. Note that even with such excellent chemical resistance, PFR 2160B is not recommended for aqueous media and amine applications.

    Tecnoflon® PFR 2160B's unique combination of heat and chemical resistance is recommended for use in high temperature chemical and hydrocarbon processing industries as well as aerospace applications.

    Due to its extreme cleanliness (low metal ions and low extractables) and superior thermal stability and anti-Plasma performance, PFR 2160B is very suitable for most dry environment Plasma (etching, PECVD, LPCVD, metal CVD, PVD, ALD, Plasma Cleans) and high temperature heat treatment semiconductor manufacturing industries.